|Title of the article||
MODELS OF TECHNOLOGICAL DEFECTS OF CONDUCTIVE PATTERNS OF PRINTED CIRCUIT BOARDS
Danilova Evgeniya Anatol'evna, senior lecturer, sub-department of radio equipment design and production, Penza State University (440026, 40 Krasnaya street, Penza, Russia), email@example.com
Background. Some technological defects of printed circuit boards, successfully passed the control procedure, can potentially develop into critical defects in the presence of external and (or) internal influences of a different kind. The complexity of defect development processes leading to PCB failures urgently requires the creation and improvement of informationmeasuring systems not only detection, but also prediction of the development of PCB defects, taking into account external influences. To solve this problem, it is necessary to analyze the models of the development of technological defects that allow predicting the development of a defect and to prepare mathematical models for their investigation.
printed circuit board, printed conductor, technological defect, mathematical model, mechanical stresses
Дата обновления: 09.06.2017 10:30